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Flex-Rigid
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軟硬結合板
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75/75 line/space – ultra high density
Sequential build-up (blind, buried, mixed materials)
Special technologies such as Bookbinder, silver shielding, buried substrates, etc…
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75/75線/間距 - 超高密度
連續堆積（盲，埋，混合材料）
Bookbinder，銀屏蔽，埋地基板等特殊技術......
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HDI
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高頻板
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Sequential buildup 4+N+4
Blind, buried, staggered & stacked
Via fill, POVIP, Micro via fill
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順序累積4 + N + 4
盲目，埋孔，交錯和堆疊
通過填充，POVIP，微通孔填充
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Thermal Dissipation & CTE
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熱耗散&CTE
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Heat sink applications (internal & external)
Heavy copper construction including selective coin insertion
Specialized laminate utilization
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散熱片應用（內部和外部）
重銅結構包括選擇性硬插入
專業的層壓板利用
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RF & Microwave
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射頻&微波
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Full PTFE? multilayer buildups
Mixed material (PTFE, FR4, Polyimides) including Rigid & Rigidflex
Specialized technologies including cavity, isolation, precision geometries & finishes.
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全PTFE?多層增強材料
混合材料（PTFE，FR4，聚酰亞胺），包括Rigid和Rigidflex
專業技術包括腔體，隔離，精密幾何形狀和表面處理。
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